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Intel Xeon X5560 - AT80602000768AA (BX80602X5560) information

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Type:CPU Manufacturer:Intel
family:Xeon microprocessors:Xeon 5500
Type CPU / Microprocessor
Market segment Server
Family
Intel Xeon 5500
Model number   
X5560
CPU part numbers
  • AT80602000768AA is an OEM/tray microprocessor
  • BX80602X5560 is a boxed microprocessor
Frequency    2800 MHz
Turbo frequency 3200 MHz (1 core)
3067 MHz (4 cores)
Bus speed    6.4 GT/s QPI (3200 MHz)
Package 1366-land Flip-Chip Land Grid Array (FC-LGA8)
1.77" x 1.67" (4.5 cm x 4.25 cm)
Socket Socket 1366 / B / LGA1366
Introduction date March 30, 2009
End-of-Life date Last order date for consumer processors is September 28, 2012
Last shipment date for consumer tray processors is March 27, 2015
Last order date for embedded processors is November 15, 2015
Last shipment date for embedded processors is May 15, 2016
Price at introduction $1172
S-spec numbers
  ES/QS processors Production processors
Part number Q1AC Q1DZ Q1GF SLBF4
AT80602000768AA + + + +
BX80602X5560       +
Architecture / Microarchitecture
Microarchitecture Nehalem
Platform Tylersburg-EP
Tylersburg-EN
Tylersburg-WS
Processor core    Nehalem-EP
Core stepping    D0 (Q1GF, SLBF4)
CPUID 106A5 (SLBF4)
Manufacturing process 0.045 micron
731 million transistors
Die size 263mm2
Data width 64 bit
The number of cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size    4 x 32 KB instruction caches
4 x 32 KB data caches
Level 2 cache size    4 x 256 KB
Level 3 cache size 8 MB
Physical memory 144 GB
Multiprocessing Up to 2 processors
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4   
  • EM64T / Extended Memory 64 technology / Intel 64   
  • NX / XD / Execute disable bit   
  • HT / Hyper-Threading technology   
  • VT-x / Virtualization technology   
  • VT-d / Virtualization for directed I/O
  • TBT / Turbo Boost technology   
Low power features
  • Thread C1/C1E, C3 and C6 states
  • Core C1/C1E, C3 and C6 states
  • Package C1/C1E, C3 and C6 states
  • Enhanced SpeedStep technology   
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 3
Supported memory: DDR3-800, DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 32
ECC supported: Yes
Other peripherals Quick Path Interconnect (2 links)
Electrical / Thermal parameters
V core    0.75V - 1.35V
Minimum/Maximum operating temperature    5°C - 75°C
5°C - 81°C
Maximum power dissipation    197.97 Watt
155.56 Watt (sustained)
Thermal Design Power    95 Watt


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